板對(duì)板 - 陣列，邊緣類型，包廂 LS2-105-01-S-D品牌、價(jià)格、PDF參數(shù)
LS2-105-01-S-D • 品牌、價(jià)格
| 元器件型號(hào) |
廠商 |
描述 |
數(shù)量 |
價(jià)格 |
| LS2-105-01-S-D |
Samtec Inc |
CONN HERMAPHRODITIC 10POS T/H |
0 |
1:$6.72000
|
| LS2-105-01-S-D-RA2 |
Samtec Inc |
CONN HERMAPHRODITIC 10POS T/H |
0 |
1:$7.58000
|
| LS2-125-01-F-D-RA2 |
Samtec Inc |
CONN HERMAPHRODITIC 50POS T/H |
0 |
1:$8.60000
|
| LS2-125-01-S-D-RA2 |
Samtec Inc |
CONN HERMAPHRODITIC 50POS T/H |
0 |
1:$11.49000
|
| LS2-130-01-F-D |
Samtec Inc |
CONN HERMAPHRODITIC 60POS T/H |
0 |
1:$7.94000
|
| LS2-130-01-F-D-RA1 |
Samtec Inc |
CONN HERMAPHRODITIC 60POS T/H |
0 |
1:$8.77000
|
| LSH-020-01-G-D-A-K-TR |
Samtec Inc |
CONN SKT STRIP SKT 40POS |
0 |
850:$4.71751
|
| LSH-040-01-G-D-A-K-TR |
Samtec Inc |
CONN SKT STRIP SKT 80POS |
0 |
875:$6.62501
|
| LSHM-130-02.5-L-DV-A-N-K-TR |
Samtec Inc |
CONN HERMAPHRODITIC 60POS |
0 |
625:$2.18400
|
| LSHM-150-03.0-F-DV-A-N-K-TR |
Samtec Inc |
HDR/SKT 0.5MM SOLDER STRAIGHT |
0 |
125:$3.11104
|
| LSS-124-01-L-DV-A |
Samtec Inc |
CONN HERMAPHRODITIC 48POS |
0 |
|
| LSS-130-01-L-DV-A |
Samtec Inc |
CONN HERMAPHRODITIC 60POS |
0 |
1:$4.00000
|
| LSS-130-01-L-DV-A-K |
Samtec Inc |
CONN SOCKET 60POS SMD |
0 |
1:$4.26000
|
| LSS-130-02-L-DV-A-K |
Samtec Inc |
CONN SOCKET 60POS SMD |
0 |
1:$4.89000
|
| LSS-140-01-L-DV-A |
Samtec Inc |
CONN SOCKET 80POS SMD |
0 |
1:$4.71000
|
| LSS-150-01-L-DV-A-K |
Samtec Inc |
CONN SOCKET 100POS SMD |
0 |
1:$5.75000
|
| LSS-150-02-L-DV-A-K |
Samtec Inc |
CONN SOCKET 100POS SMD |
0 |
1:$5.84000
|
| LST-112-07-G-D |
Samtec Inc |
CONN HERMAPHRODITIC 24POS |
0 |
1:$4.58000
|
| LTH-010-01-G-D-A-K |
Samtec Inc |
TERM STRIP LP 20POS SMD |
0 |
1:$6.16000
|
| LTH-030-01-G-D-A-K |
Samtec Inc |
TERM STRIP LP 60POS SMD |
0 |
1:$7.54000
|
| LTH-050-01-G-D-A-K |
Samtec Inc |
TERM STRIP LP 100POS SMD |
0 |
1:$8.82000
|
LS2-105-01-S-D • PDF參數(shù)
| 類別: |
板對(duì)板 - 陣列，邊緣類型，包廂
|
| 連接器類型: |
無(wú)公形或母形之分，自配接
|
| 位置數(shù): |
10
|
| 間距: |
0.079"（2.00mm）
|
| 行數(shù): |
2
|
| 安裝類型: |
通孔
|
| 特點(diǎn): |
銷鎖
|
| 觸點(diǎn)表面涂層: |
金
|
| 觸點(diǎn)涂層厚度: |
30µin（0.76µm）
|
| 包裝: |
管件
|
| 配接層疊高度: |
-
|
| 板上方高度: |
0.250"（6.35mm）
|