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參數(shù)資料
| 型號(hào)： | DB800 |
| 廠商： | DIOTEC SEMICONDUCTOR AG |
| 英文描述： | 8 AMP SILICON BRIDGE RECTIFIERS |
| 中文描述： | 8放大器硅橋式整流器 |
| 文件頁數(shù)： | 1/2頁 |
| 文件大小： | 416K |
| 代理商： | DB800 |
FEATURES
DataSheetNo.BRDB-800-1C
MECHANICAL SPECIFICATION
ACTUAL SIZE
E31
8 AMP SILICONBRIDGERECTIFIERS
BH
LL
LD
D1
D1
BL
BL
+
_
MAXIMUMRATINGS&ELECTRICAL CHARACTERISTICS
!
"
#
$
%
&
"
"
'
"
(
)
$
*
AverageForwardRectifiedCurrent
PeakForwardSurgeCurrent.
Single60HzHalf-SineWave
SuperimposedonRatedLoad(JEDECMethod).T =150 C
+
,
JunctionOperatingandStorageTemperatureRange
T
-
,T
.0/1
I
2
°C
3
4465
79;:4<
ContinuousPowerDissipationinV
Region
@T
=80 C(HeatSinkTemp)
=
>@B
CDFE
PARAMETER(TESTCONDITIONS)
MaximumDCBlockingVoltage
MaximumPeakRecurrentReverseVoltage
WorkingPeakReverseVoltage
SeriesNumber
V
GHJI
V
K@K@L
V
M6N
P
M@OQPR
V
S@T
SYMBOL
UWVYX[W\Y]_^WYacbYdfeYgfhYfjYkmlYpoYsrY
AMPS
UNITS
VOLTS
u@v
P
w
xyz|{0}~0B|0c0B
0
￠￠¤￡￥§|¨0¨aa0-°0±±
RMSReverseVoltage
2033
′μ
·
1
o00àá¤èêéì0íD°0òó
0
0×
PowerDissipationinV
Regionfor100 SSquareWave
ù
ú;Bü
Y
Té;BéWéWíYe
ò
ó
Q÷
òá@Bùè
;üYò
WATTS
ThermalEnergy(RatingforFusing)
I t
AMPS
SEC
I
@T =50 C(Note1)
@T =50 C(Note2)
TypicalThermalResistance
R
R
!
V
"#
MaximumForwardVoltage(PerDiode)at4 AmpsDC
VOLTS
VOLTS
$%
&
')((+*-/.
(10
2)33+4-/6
317
89
:
Minimum AvalancheVoltage
Maximum AvalancheVoltage
V
;
<=>@BA
C
V
D
EFGH-IK
MaximumReverseCurrentatRatedV
LM
@T =25 C
@T =125 C
P
Q
I
RS
MinimumInsulationBreakdownVoltage(CircuittoCase)
V
T
UV
Junctionto Ambient(Note2)
JunctiontoCase(Note1)
WX
YZ\[
]_^`X_WX
YWa
b
cd
e
A
fggg
h
C/W
i_j
k
l
m
n
oKn
p
q
r
s/t)uvwx
RATINGS
INCHES
MILLIMETERS
MIN
6.4
12.2
18.5
SYM
BL
BH
D1
MAX
MAX
7.6
13.2
19.6
MIN
0.73
0.25
0.48
0.77
0.3
0.52
LL
LD
1.2
1.3
0.048
0.875
0.052
22.2
n/a
n/a
+
_
SERIESDB800-DB810and ADB804-ADB808
DT
DB804
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UL RECOGNIZED-FILE#E124962
Tel.:(310)767-1052Fax:(310)767-7958
DIOTECELECTRONICSCORP.
Gardena,CA 90248U.S.A
18020HobartBlvd.,UnitB
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ABDB-800-1C
BUILT-INSTRESSRELIEFMECHANISMFOR
SUPERIORRELIABILITY ANDPERFORMANCE
SURGEOVERLOADRATINGTO400 AMPSPEAK
VOIDFREEVACUUMDIESOLDERINGFORMAXIMUM
MECHANICAL STRENGTH ANDHEATDISSIPATION
(SolderVoids:Typical<2%,Max.<10%ofDie Area)
Case:
Terminals:Roundsilverplatedcopperpins
Soldering:PerMIL-STD202Method208guaranteed
Polarity:Markedonsideofcase;positiveleadatbeveledcorner
MountingPosition: Any.Throughholeprovidedfor#6screw
Weight:0.18Ounces(5.4Grams)
MoldedEpoxy(UL FlammabilityRating94V-0)
MECHANICAL DATA
RoHSCOMPLIANT
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