參數(shù)資料
型號: CY7C1314BV18-250BZC
廠商: CYPRESS SEMICONDUCTOR CORP
元件分類: DRAM
英文描述: 18-Mbit QDR-II SRAM 2-Word Burst Architecture
中文描述: 512K X 36 QDR SRAM, 0.45 ns, PBGA165
封裝: 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165
文件頁數(shù): 7/23頁
文件大?。?/td> 262K
代理商: CY7C1314BV18-250BZC
PRELIMINARY
CY7C1310BV18
CY7C1910BV18
CY7C1312BV18
CY7C1314BV18
Document #: 38-05619 Rev. **
Page 7 of 23
Functional Overview
The CY7C1310BV18, CY7C1910BV18, CY7C1312BV18 and
CY7C1314BV18 are synchronous pipelined Burst SRAMs
equipped with both a Read port and a Write port. The Read
port is dedicated to Read operations and the Write port is
dedicated to Write operations. Data flows into the SRAM
through the Write port and out through the Read port. These
devices multiplex the address inputs in order to minimize the
number of address pins required. By having separate Read
and Write ports, the QDR-II completely eliminates the need to
“turn-around” the data bus and avoids any possible data
contention, thereby simplifying system design. Each access
consists of two 8-bit data transfers in the case of
CY7C1310BV18, two 9-bit data transfers in the case of
CY7C1910BV18,two 18-bit data transfers in the case of
CY7C1312BV18 and two 36-bit data transfers in the case of
CY7C1314BV18, in one clock cycle.
Accesses for both ports are initiated on the rising edge of the
positive Input Clock (K). All synchronous input timings are
referenced from the rising edge of the input clocks (K and K)
and all output timings are referenced to the rising edge of
output clocks (C and C or K and K when in single clock mode).
All synchronous data inputs (D
[x:0]
) inputs pass through input
registers controlled by the input clocks (K and K). All
synchronous data outputs (Q
[x:0]
) outputs pass through output
registers controlled by the rising edge of the output clocks (C
and C or K and K when in single clock mode).
All synchronous control (RPS, WPS, BWS
[x:0]
) inputs pass
through input registers controlled by the rising edge of the
input clocks (K and K).
CY7C1312BV18 is described in the following sections. The
same
basic
descriptions
CY7C1910BV18 and CY7C1314BV18.
apply
to
CY7C1310BV18
Read Operations
The CY7C1312BV18 is organized internally as 2 arrays of
512K x 18. Accesses are completed in a burst of two
sequential 18-bit data words. Read operations are initiated by
K
Input-Clock
Negative Input Clock Input
. K is used to capture synchronous inputs being presented
to the device and to drive out data through Q
[x:0]
when in single clock mode.
CQ is referenced with respect to C
. This is a free running clock and is synchronized
to the output clock (C) of the QDR-II. In the single clock mode, CQ is generated with
respect to K. The timings for the echo clocks are shown in the AC Timing table.
CQ is referenced with respect to C
. This is a free running clock and is synchronized
to the output clock (C) of the QDR-II. In the single clock mode, CQ is generated with
respect to K. The timings for the echo clocks are shown in the AC Timing table.
Output Impedance Matching Input
. This input is used to tune the device outputs to the
system data bus impedance. CQ, CQ, and Q
[x:0]
output impedance are set to 0.2 x RQ,
where RQ is a resistor connected between ZQ and ground. Alternately, this pin can be
connected directly to V
DD
, which enables the minimum impedance mode. This pin cannot
be connected directly to GND or left unconnected.
DLL Turn Off, active LOW
. Connecting this pin to ground will turn off the DLL inside the
device. The timings in the DLL turned off operation will be different from those listed in
this data sheet. More details on this operation can be found in the application note, “DLL
Operation in the QDR-II.”
TDO for JTAG
.
TCK pin for JTAG
.
TDI pin for JTAG
.
TMS pin for JTAG
.
Not connected to the die
. Can be tied to any voltage level.
Not connected to the die
. Can be tied to any voltage level.
Not connected to the die
. Can be tied to any voltage level.
Not connected to the die
. Can be tied to any voltage level.
Not connected to the die
. Can be tied to any voltage level.
Reference Voltage Input
. Static input used to set the reference level for HSTL inputs
and Outputs as well as AC measurement points.
Power supply inputs to the core of the device
.
Ground for the device
.
Power supply inputs for the outputs of the device
.
CQ
Echo Clock
CQ
Echo Clock
ZQ
Input
DOFF
Input
TDO
TCK
TDI
TMS
NC
NC/36M
NC/72M
NC/144M
NC/288M
V
REF
Output
Input
Input
Input
N/A
N/A
N/A
N/A
N/A
Input-
Reference
Power Supply
Ground
Power Supply
V
DD
V
SS
V
DDQ
Pin Definitions
(continued)
Pin Name
I/O
Pin Description
相關(guān)PDF資料
PDF描述
CY7C1910BV18 18-Mbit QDR-II SRAM 2-Word Burst Architecture
CY7C1310BV18-167BZC 18-Mbit QDR-II SRAM 2-Word Burst Architecture
CY7C1910BV18-167BZC 18-Mbit QDR-II SRAM 2-Word Burst Architecture
CY7C1310BV18-200BZC 18-Mbit QDR-II SRAM 2-Word Burst Architecture
CY7C1910BV18-200BZC 18-Mbit QDR-II SRAM 2-Word Burst Architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1314BV18-250BZCES 制造商:Cypress Semiconductor 功能描述:SRAM SYNC DUAL 1.8V 18MBIT 512KX36 0.45NS 165FBGA - Bulk
CY7C1314BV18-250BZXC 功能描述:靜態(tài)隨機(jī)存取存儲器 512Kx36 1.8V QDR II 靜態(tài)隨機(jī)存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1314CV18-167BZC 功能描述:靜態(tài)隨機(jī)存取存儲器 512Kx36 1.8V QDR II 靜態(tài)隨機(jī)存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1314CV18-200BZC 功能描述:靜態(tài)隨機(jī)存取存儲器 512Kx36 1.8V QDR II 靜態(tài)隨機(jī)存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1314CV18-200BZI 功能描述:靜態(tài)隨機(jī)存取存儲器 18-Mbit QDR-II 靜態(tài)隨機(jī)存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray