參數(shù)資料
型號(hào)： CY7C1303BV25
廠(chǎng)商： Cypress Semiconductor Corp.
英文描述： 18-Mbit Burst of 2 Pipelined SRAM with QDR Architecture(18Mbit，Burst of 2，QDR結(jié)構(gòu)，流水線(xiàn)SRAM)
中文描述： 18兆位的2四年防務(wù)審查架構(gòu)（18Mbit，2突發(fā)流水線(xiàn)SRAM的突發(fā)，國(guó)防評(píng)估報(bào)告結(jié)構(gòu)，流水線(xiàn)的SRAM）
文件頁(yè)數(shù)： 18/19頁(yè)
文件大?。?/td> 821K
代理商： CY7C1303BV25
CY7C1306BV25
CY7C1303BV25
Document #: 38-05627 Rev. *A
Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Page 18 of 19
Ordering Information
Quad Data Rate
SRAM and QDR
SRAM comprise a new family of products developed by Cypress, IDT, NEC, Renesas and
Samsung. All products and company names mentioned in this document may be the trademarks of their respective holders.
“Not all of the speed, package and temperature ranges are available. Please contact your local sales representative or
visit
www.cypress.com
for actual products offered”.
Speed
(MHz)
Ordering Code
Diagram
167
CY7C1303BV25-167BZC
51-85180 165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
CY7C1306BV25-167BZC
CY7C1303BV25-167BZXC
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead free
CY7C1306BV25-167BZXC
CY7C1303BV25-167BZI
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm)
CY7C1306BV25-167BZI
CY7C1303BV25-167BZXI
165-ball Fine Pitch Ball Grid Array (13 x 15 x 1.4 mm) Lead free
CY7C1306BV25-167BZXI
Package
Package Type
Operating
Range
Commercial
Industrial
Package Diagram
A
PIN 1 CORNER
1
13.00±0.10
7
1.00
0.50 (0.25 M C A B
0.25 M0.05 M C
0.05 M C
B
A
0.15(4X)
0
SEATING PLANE
0
0
0
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
5
6
7
8
9
10
10.00
1
B
C
D
E
F
G
H
J
K
L
M
N
11
11
10
9
8
6
7
5
4
3
2
1
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
1
13.00±0.10
B
C
1
5.00
0
0.50 (165X)
1
SOLDER PAD TYPE : NON-SOLDER MASK DEFINED (NSMD)
PACKAGE WEIGHT : 0.475g
JEDEC REFERENCE : MO-216 / DESIGN 4.6C
PACKAGE CODE : BB0AC
PACKAGE CODE : BB0AC
51-85180-*A
165 FBGA 13 x 15 x 1.40 MM BB165D/BW165D
165-ball FBGA (13 x 15 x 1.4 mm) (51-85180)
A
1
PIN 1 CORNER
1
13.00±0.10
7
1.00
B
A
0.15(4X)
0
SEATING PLANE
0
0
0
PIN 1 CORNER
TOP VIEW
BOTTOM VIEW
2
3
4
5
6
7
8
9
10
10.00
1
B
C
D
E
F
G
H
J
K
L
M
N
11
11
10
9
8
6
7
5
4
3
2
1
P
R
P
R
K
M
N
L
J
H
G
F
E
D
C
B
A
A
1
13.00±0.10
B
C
1
5.00
0
PACKAGE WEIGHT : 0.475g
51-85180-*A
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
CY7C1303BV25-167BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 1Mx18 2.5V QDR 靜態(tài)隨機(jī)存取存儲(chǔ)器 COM RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪(fǎng)問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1303BV25-167BZCES 制造商:Cypress Semiconductor 功能描述:SRAM SYNC DUAL 2.5V 18MBIT 1MX18 2.5NS 165FBGA - Bulk
CY7C1303TV25-167BZC 功能描述:靜態(tài)隨機(jī)存取存儲(chǔ)器 NV靜態(tài)隨機(jī)存取存儲(chǔ)器 167 MHz 2.5V RoHS:否 制造商:Cypress Semiconductor 存儲(chǔ)容量:16 Mbit 組織:1 M x 16 訪(fǎng)問(wèn)時(shí)間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1303V25-133BZC 制造商:Cypress Semiconductor 功能描述:SRAM SYNC SGL 2.5V 18MBIT 1MX18 3NS 165FBGA - Trays
cy7c1303v25-167bzc 制造商:Cypress Semiconductor 功能描述:SRAM SYNC SGL 2.5V 18MBIT 1MX18 2.5NS 165FBGA - Trays
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