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參數(shù)資料
| 型號： | AT24C16SC |
| 廠商： | Atmel Corp. |
| 英文描述： | Triple 3-Input Positive-NOR Gate 14-TSSOP -40 to 85 |
| 中文描述： | 兩線串行EEPROM智能卡模塊 |
| 文件頁數(shù)： | 20/24頁 |
| 文件大?。?/td> | 445K |
| 代理商： | AT24C16SC |
20
AT24C01A/02/04/08A/16A
0180V–SEEPR–8/05
8A2 – TSSOP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
8A2
, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
DRAWING NO.
8A2
R
REV.
B
5/30/02
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
D
2.90
3.00
3.10
2, 5
E
6.40 BSC
E1
4.30
4.40
4.50
3, 5
A
–
–
1.20
A2
0.80
1.00
1.05
b
0.19
–
0.30
4
e
0.65 BSC
L
0.45
0.60
0.75
L1
1.00 REF
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
(0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
Side View
End View
Top View
A2
A
L
L1
D
1
2
3
E1
N
b
Pin 1 indicator
this corner
E
e
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