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參數(shù)資料
| 型號： | AN610 |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701 |
| 中文描述： | PolarPAK的焊點熱疲勞的可靠性基于IPC - 9701 |
| 文件頁數(shù)： | 6/17頁 |
| 文件大?。?/td> | 1211K |
| 代理商： | AN610 |
www.vishay.com
6
Document Number 73507
31-Aug-05
Vishay Siliconix
AN610
Rework results:
Summary of complete assembly:
Solder release is consistent
The amount of voids for this package is in a range of
5% to 30%, which includes noise generated during
the 5DX measurement due to the complexity of the
package lead-frame
No problem with rework
d) Thermal fatigue test:
This is the main phase of the DOE. Up to this point
the work was focused on preparation. The thermal
fatigue testing comprised of various steps:
(1) Test definition
(2) Test setup
(3) Temperature cycling chamber calibration
(4) Temperature cycling
(5) Test database
(6) Analysis result summary
(1) Test definition:
Appendix D is a brief summary of thermal fatigue by
temperature cycling test definition guidelines derived
from IPC-9701.
Basically, each solder joint is subjected to 3,000 tem-
perature cycles as per the profile shown in Figure 13.
Figure 11: Smallest Void After Rework
Component Type: PolarPAK
Board#: 32
Location: U12
Figure 12: Largest void after rework
Component Type: PolarPAK
Board#: 33
Location: U13
Figure 13: TC1 0 °C to 100 °C tolerance +/-5 °C
Time
Temp
0
0
5
100
15
100
20
0
30
0
35
100
45
100
50
0
Temp Cycle
0
20
40
60
8
0
100
120
0
5
15
20
3
0
3
5
45
50
Time in Min.
T
T
s
(m
a
x)
T
s
(min)
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