參數(shù)資料
型號(hào)： AN610
廠商： Vishay Intertechnology,Inc.
英文描述： PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701
中文描述： PolarPAK的焊點(diǎn)熱疲勞的可靠性基于IPC - 9701
文件頁(yè)數(shù)： 5/17頁(yè)
文件大?。?/td> 1211K
代理商： AN610
Vishay Siliconix
AN610
Document Number 73507
31-Aug-05
www.vishay.com
5
Figure 9 shows the arrangement of a thermocouple
on a PCB during rework. The thermocouples are
located on the rework part, close to the lead or foot of
the adjacent part, and on the PCB surface close to
the rework location to insure that the actual part and
PCB temperature limits are never exceeded.
Table 3:
BGA Rework Machine Settings
Figure 8: Rework Reflow Profile
Rework Profile 1 - Part Removal, Lead-Free
Peak temperature: 236.7 °CTime above 217 °C: 82 seconds
Figure 9: Arrangement of Thermocouple on PCB During Rework
Thermocouple attachment locations for rework
profile 1: U6 (reworked location, T/C on the package)
U7 (adjacent location, T/C on the solder joint)U11 (adjacent location,
T/C on the solder joint)
Figure: 10: Rework Reflow Profile
Rework Profile 2 - Part Assembly, Lead-Free
Peak temperature: 235.6 °CTime above 217 °C: 45 seconds
Profile
Event/Cycle
Profile 1
Profile 2
Preheat
Top: 200 °C
Bottom: 400 °C
Time: T/C @ 90 °C
Top: 200 °C
Bottom: 400 °C
Time: T/C @ 90 °C
Soak
Top: 300 °C, Flow: 50%
Bottom: 350 °C
Time: 60 seconds
Top: 300 °C, Flow: 50%
Bottom: 350 °C
Time: 90 seconds
Ramp
Top: 350 °C, Flow:
50%Bottom: 350
°CTime: 20 seconds
Top: 350 °C, Flow:
50%Bottom: 350
°CTime: 30 seconds
Top: 350 °C, Flow: 50%
Bottom: 350 °C
Time: 20 seconds
Reflow
Top: 350 °C, Flow: 55%
Bottom: 350 °C
Time: 30 seconds
Nozzle Height
0.125 in.
0.05 in.
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