參數(shù)資料
型號： AN610
廠商： Vishay Intertechnology,Inc.
英文描述： PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701
中文描述： PolarPAK的焊點(diǎn)熱疲勞的可靠性基于IPC - 9701
文件頁數(shù)： 4/17頁
文件大?。?/td> 1211K
代理商： AN610
www.vishay.com
4
Document Number 73507
31-Aug-05
Vishay Siliconix
AN610
Table 1
2. Pick and place
Machine: Juki 2060E
Note: In each board, leave the first location empty (no
load/part)
3. Reflow
Machine: BTU Pyramax 98
(seven heating zones and two cooling zones) - no
nitrogen, air only
RSS profile shown in Figure 7 was used for the lead-
free solder paste
For immediate reference, the reflow process and
parameters used for lead-free solder are summa-
rized below:
Solder joint visual inspection criteria were derived
from IPC-A-610D[4]; refer to Appendix D for relevant
details. The visual inspection also included looking
for any obvious solder joint defects such as a cold
joint, solder bumps, bridges, or other flaws.
In addition, 2DX X-ray and 5DX X-ray processes
were employed to inspect void levels on each solder
joint. All images were compared by void level. During
2DX inspection the focus was on number and size of
voids. 5DX measurements were sorted and selected
based on the percentage of void areas. The first
method, 2DX image review, was a qualitative com-
parison. The second method, 5DX parametric data,
was a quantitative analysis. See Appendix A for best-
case/worst-case void level X-ray images for Polar-
PAK. Using these criteria, good solder assemblies
were achieved with void levels less than 25%.
c) Rework: Using the worst-case locations from the X-
ray inspection results, six PCBs and two locations on
each board were selected and marked "X" with in-
delegable black ink for rework. The originally sol-
dered part was de-soldered and replaced with a new
part.
Table 2:
Rework Locations for Lead-Free Assemblies
Rework setup:
AirVac DRS24 - BGA rework machine
Special rework nozzle
Rework steps:
1. Remove components using a hot-air BGA rework
machine
2. Clean up pads using a soldering iron
3. Solder bump pads using a soldering iron and sol-
der wire SAC 305.
4. Apply no-clean gel flux on the pad
5. Place the component using the hot-air BGA
rework machine
6. Reflow the component using the hot-air BGA
rework machine per profiles shown below in
Figure 8
Version
Comp Type
Buildt Qty
Profile
Stencil Thickness
Aperture Design
Drain-Gate (mils)
21 x 189.2
Source
94.5 x 189.2
CA
PolarPAK
7
RSS
5 mils
Figure 7: RSS Profile for Lead-Free
Peak Temperature: 237 °C
Time above 220 °C: 30 seconds
Soak time (120 °C to 200 °C): 115 seconds
Board #
Side
Comp Type
Rework
Location
U10, U11
29
CA
PolarPAK
30
CA
PolarPAK
U11, U15
31
CA
PolarPAK
U12, U15
32
CA
PolarPAK
U11, U12
33
CA
PolarPAK
U13, U14
34
CA
PolarPAK
No Rework
35
CA
PolarPAK
U10, U12
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