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參數(shù)資料
| 型號： | AN610 |
| 廠商： | Vishay Intertechnology,Inc. |
| 英文描述： | PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701 |
| 中文描述： | PolarPAK的焊點熱疲勞的可靠性基于IPC - 9701 |
| 文件頁數(shù)： | 14/17頁 |
| 文件大?。?/td> | 1211K |
| 代理商： | AN610 |
www.vishay.com
14
Document Number 73507
31-Aug-05
Vishay Siliconix
AN610
Appendix C
PCB Fabrication
Material:
Thickness:
Number of copper layers:
Nominal outer layer (top/bottom) cu thickness: 35 μm [1378 μin.] 0.5 oz.
Nominal inner layer cu thickness:
Nominal FR4 insulation layer thickness:
Even internal layers 2, 4, 5, 7 from each side:
Cu coverage on power/ground layers:70%
Cu coverage on Signal trace:
Min. outer layer trace width:
Test pads for each daisy chain to be provided
Minimum 15-mm [0.6-in.] clearance around each part for rework and if necessary the removal of the failed part with-
out damage to the adjacent part/trace
Minimum via for large (drain) land pad:50%
Via size:
Pitch:
1.0 mm [0.040 in.]
Diameter:
0.3 mm [0.012 in.]
Solder mask encroachment on the via pad for these via on the bottom side to prevent the solder from spreading on
the bottom side.
Square test pad size:
1.5 mm [0.060 in.]
PTH Drill:
1.0 mm [0.040 in.]
Surface finish: (preferred)OSP (Organic Solderability Preservative)
Silkscreen or Cu etch to label all components, all test points, and location of pin is mandated.
FR-4
3.175 mm [0.125 in.]
16
12 μm [472 μin.] 0.5 oz.
231.8 μm [7,709 μin.]
Power and ground
40%
150 μm [5906 μin.]
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