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參數(shù)資料
| 型號(hào)： | AMMP-6222-TRG |
| 元件分類： | 放大器 |
| 英文描述： | 7000 MHz - 21000 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 5 X 5 MM, 1.25 MM HEIGHT, LEAD FREE, SMT, 8 PIN |
| 文件頁數(shù)： | 2/11頁 |
| 文件大?。?/td> | 414K |
| 代理商： | AMMP-6222-TRG |
0
Recommended SMT Attachment for 5x5 Package
Notes:
1. Dimensions are in Inches [Millimeters]
2. All grounds must be soldered to PCB RF
3. Material is Rogers RO4350, 0.010” thick
Figure 23. PCB Land Pattern and Stencil Layouts
Figure 24. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
The AMMP Packaged Devices are compatible with high
volume surface mount PCB assembly processes.
The PCB material and mounting pattern, as defined in
the data sheet, optimizes RF performance and is strongly
recommended. An electronic drawing of the land pattern
is available upon request from Agilent Sales & Application
Engineering.
Manual Assembly
Follow ESD precautions while handling packages.
Handling should be along the edges with tweezers.
Recommended attachment is conductive solder paste.
Please see recommended solder reflow profile. Neither
Conductive epoxy or hand soldering is recommended.
Apply solder paste using a stencil printer or dot
placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance.
Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temp. to avoid damage
due to thermal shock.
Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
A properly designed solder screen or stencil is required to
ensure optimum amount of solder paste is deposited onto
the PCB pads. The recommended stencil layout is shown
in Figure 23. The stencil has a solder paste deposition
opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
The most commonly used solder reflow method is
accomplished in a belt furnace using convection heat
transfer.The suggested reflow profile for automated reflow
processes is shown in Figure 24. This profile is designed
to ensure reliable finished joints. However, the profile
indicated in Figure 14 will vary among different solder
pastes from different manufacturers and is shown here for
reference only.
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Te
m
p
(
C)
Peak = 250 ± 5C
Ramp 1 Preheat Ramp 2 Reflow
Cooling
Melting point = 218C
Ground vias should
be solder filled
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| AMMP-6232 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:18 TO 32 GHZ GAAS HIGH LINEARITY LNA IN SMT PACKAGE |
| AMMP-6232-BLKG | 功能描述:射頻放大器 18-32GHz Hi-Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6232-TR1G | 功能描述:射頻放大器 18-32GHz Hi-Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6232-TR2G | 功能描述:射頻放大器 18-32GHz Hi-Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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