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參數(shù)資料
| 型號(hào)： | ADG609BRZ-REEL |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 8/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MULTIPLEXER DUAL 4X1 16SOIC |
| 產(chǎn)品培訓(xùn)模塊： | Switch Fundamentals |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 功能： | 多路復(fù)用器 |
| 電路： | 2 x 4:1 |
| 導(dǎo)通狀態(tài)電阻： | 50 歐姆 |
| 電壓電源： | 單/雙電源 |
| 電壓 - 電源，單路/雙路(±)： | 3V，5V，±5V |
| 電流 - 電源： | 50nA |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-SOIC |
| 包裝： | 帶卷 (TR) |
ADG608/ADG609
REV. A
–5–
ABSOLUTE MAXIMUM RATINGS
1
(TA = +25°C unless otherwise noted)
VDD to VSS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +13 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V
Analog, Digital Inputs
2
. . . . . . . . . . . . . . –0.3 V to VDD + 2 V
or 20 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle Max) . . . . . . . . . . 40 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40
°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . – 55
°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150
°C
Plastic DIP Package
θ
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . .
117
°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . +260
°C
SOIC Package
θ
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 77
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
TSSOP Package
θ
JA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 158°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°C
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >5000 V
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Only one absolute maximum rating may be applied at any one time.
2Overvoltages at A, S, D or EN will be clamped by internal diodes. Current should
be limited to the maximum ratings given.
PIN CONFIGURATIONS
DIP/SOIC/TSSOP
A0
EN
A1
GND
S2A
S3A
S4A
S2B
S3B
S4B
VSS
S1A
VDD
S1B
DA
DB
1
2
16
15
5
6
7
12
11
10
3
4
14
13
8
9
TOP VIEW
(Not to Scale)
ADG609
A0
EN
S2
S3
S4
VSS
S1
D
1
2
16
15
5
6
7
12
11
10
3
4
14
13
8
9
TOP VIEW
(Not to Scale)
ADG608
A1
A2
S5
S6
S7
GND
VDD
S8
Table I. ADG608 Truth Table
A2
A1
A0
EN
ON SWITCH
X
0
NONE
00
0
1
00
1
2
01
0
1
3
01
1
4
10
0
1
5
10
1
6
11
0
1
7
11
1
8
X = Don’t Care
Table II. ADG609 Truth Table
A1
A0
EN
ON SWITCH PAIR
X
0
NONE
00
1
01
1
2
10
1
3
11
1
4
X = Don’t Care
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