
AD8072/AD8073
REV. 0
–4–
WARNING!
ESD SENSITIVE DEVICE
C AUT ION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8072 and AD8073 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. T herefore, proper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUT E MAX IMUM RAT INGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12.6 V
Internal Power Dissipation
2
AD8072 8-Lead Plastic (N) . . . . . . . . . . . . . . . . . 1.3 Watts
AD8072 8-Lead Small Outline (SO-8) . . . . . . . . . 0.9 Watts
AD8073 14-Lead Plastic (N) . . . . . . . . . . . . . . . . 1.6 Watts
AD8072 14-Lead Small Outline (R) . . . . . . . . . . . 1.0 Watts
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .
±
V
S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . .
±
1.25 V
Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . . . . .
Observe Power Derating Curves
Storage T emperature Range
N & R Packages . . . . . . . . . . . . . . . . . . . . –65
°
C to +125
°
C
Lead T emperature Range (Soldering 10 sec) . . . . . . . +300
°
C
NOT ES
1
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. T his is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
8-Pin Plastic Package:
θ
JA
= 90
°
C/Watt
8-Pin SOIC Package:
θ
JA
= 140
°
C/Watt
14-Pin Plastic Package:
θ
JA
= 75
°
C/Watt
14-Pin SOIC Package:
θ
JA
= 120
°
C/Watt
ORDE RING GUIDE
T emperature
Range
Package
Description
Package
Option
Model
AD8072JN
AD8072JR
AD8072JR-REEL
AD8073JN
AD8073JR
AD8073JR-REEL
0
°
C to +70
°
C
0
°
C to +70
°
C
0
°
C to +70
°
C
0
°
C to +70
°
C
0
°
C to +70
°
C
0
°
C to +70
°
C
8-Pin Plastic DIP
8-Pin SOIC
Reel 8-Pin SOIC
14-Pin Plastic DIP
14-Pin Narrow SOIC
Reel 14-Pin SOIC
N-8
SO-8
SO-8
N-14
R-14
R-14
MAX IMUM POWE R DISSIPAT ION
T he maximum power that can be safely dissipated by the
AD8072 and AD8073 is limited by the associated rise in junc-
tion temperature. T he maximum safe junction temperature for
plastic encapsulated devices is determined by the glass transition
temperature of the plastic, approximately +150
°
C. Exceeding
this limit temporarily may cause a shift in parametric perfor-
mance due to a change in the stresses exerted on the die by the
package. Exceeding a junction temperature of +175
°
C for an
extended period can result in device failure.
While the AD8072 and AD8073 are internally short circuit pro-
tected, this may not be sufficient to guarantee that the maxi-
mum junction temperature (+150
°
C) is not exceeded under all
conditions. T o ensure proper operation, it is necessary to ob-
serve the maximum power derating curves shown in Figures 2
and 3.
M
AMBIENT TEMPERATURE –
°
C
2.0
1.5
0
90
–40 –30 –20 –10
0
10
20
30
50
60
70
80
40
1.0
0.5
8-PIN MINI-DIP PACKAGE
8-PIN SOIC PACKAGE
T
J
= +150
°
C
Figure 2. AD8072 Maximum Power Dissipation vs.
Temperature
AMBIENT TEMPERATURE –
°
C
2.5
2.0
0.5
–50
90
–40
M
–30 –20 –10
0
10 20
30
40 50
60
80
1.5
1.0
70
14-PIN SOIC
14-PIN DIP PACKAGE
T
J
= +150
°
C
Figure 3. AD8073 Maximum Power Dissipation vs.
Temperature