參數(shù)資料
型號(hào)： AD7835AP
廠商： ANALOG DEVICES INC
元件分類(lèi)： DAC
英文描述： LC2MOS Quad 14-Bit DAC
中文描述： QUAD, PARALLEL INPUT LOADING, 10 us SETTLING TIME, 14-BIT DAC, PQCC44
封裝： PLASTIC, MO-047AC, LCC-44
文件頁(yè)數(shù)： 4/16頁(yè)
文件大?。?/td> 404K
代理商： AD7835AP
REV. A
–4–
AD7834/AD7835
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25
°
C unless otherwise noted)
V
CC
to DGND . . . . . . . . . . . . . . . –0.3 V, +7 V or V
DD
+ 0.3 V
(Whichever Is Lower)
V
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V
V
SS
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –17 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +0.3 V
Digital Inputs to DGND . . . . . . . . . . . . . .–0.3 V, V
CC
+ 0.3 V
V
REF
(+) to V
REF
(–) . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +18 V
V
REF
(+) to AGND . . . . . . . . . . . . . . . V
SS
– 0.3 V, V
DD
+ 0.3 V
V
REF
(–) to AGND . . . . . . . . . . . . . . . V
SS
– 0.3 V, V
DD
+ 0.3 V
DSG to AGND . . . . . . . . . . . . . . . . . V
SS
– 0.3 V, V
DD
+ 0.3 V
V
OUT
(1–4) to AGND . . . . . . . . . . . . V
SS
– 0.3 V, V
DD
+ 0.3 V
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . . . .–40
°
C to +85
°
C
Extended (S Version). . . . . . . . . . . . . . . . .–55
°
C to +125
°
C
Storage Temperature Range . . . . . . . . . . . . .–65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°
C
Plastic Package
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . +75
°
C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°
C
Cerdip Package
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . +52
°
C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300
°
C
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7834/AD7835 feature proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ORDERING GUIDE
Linearity
Error
(LSBs)
Temperature
Range
DNL
(LSBs)
Package
Option
1
Model
AD7834AR
AD7834BR
AD7834AN
AD7834BN
AD7834SQ
AD7835AS
2
AD7835BS
2
AD7835AP
2
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–55
°
C to +125
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
±
2
±
1
±
2
±
1
±
2
±
2
±
1
±
2
±
0.9
±
0.9
±
0.9
±
0.9
±
0.9
±
0.9
±
0.9
±
0.9
R-28
R-28
N-28
N-28
Q-28
S-44
S-44
P-44A
NOTES
1
R = Small Outline IC (SOIC); N = Plastic DIP; Q = Cerdip; S = Plastic Quad Flatpack (PQFP);
P = Plastic Leaded Chip Carrier (PLCC).
2
Contact Sales Office for availability.
SOIC Package
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . +75
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
PQFP Package
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 95
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
PLCC Package
θ
JA
Thermal Impedance. . . . . . . . . . . . . . . . . . . . . . +55
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
Power Dissipation (Any Package) . . . . . . . . . . . . . . . .480 mW
NOTES
1
Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch up.
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