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參數(shù)資料
| 型號(hào)： | 407MS8GE |
| 廠商： | 美國(guó)訊泰微波有限公司上海代表處 |
| 英文描述： | GaAs InGaP HBT MMIC POWER AMPLIFIER, 5.0 - 7.0 GHz |
| 中文描述： | 砷化鎵的InGaP HBT MMIC功率放大器，5.0 - 7.0吉赫 |
| 文件頁(yè)數(shù)： | 4/8頁(yè) |
| 文件大?。?/td> | 320K |
| 代理商： | 407MS8GE |
A
5
5 - 153
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
Outline Drawing
Absolute Maximum Ratings
Gain, Power & Quiescent
Supply Current vs. Vpd @ 5.8 GHz
Collector Bias Voltage (Vcc1, Vcc2)
+5.5 Vdc
Control Voltage (Vpd)
+5.5 Vdc
RF Input Power (RFin)(Vs = Vpd = +5.0 Vdc)
+20 dBm
Junction Temperature
150 °C
Continuous Pdiss (T = 85 °C)
(derate 31 mW/°C above 85 °C)
2 W
Thermal Resistance
(junction to ground paddle)
32 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
5
10
15
20
25
30
0
50
100
150
200
250
2.5
3
3.5
4
4.5
5
P1dB
Psat
Gain
Icq
G
I
Vpd (Vdc)
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO
PCB RF GROUND.
Part Number
Package Body Material
Lead Finish
MSL Rating
Package Marking
[3]
HMC407MS8G
Low Stress Injection Molded Plastic
Sn/Pb Solder
MSL1
[1]
H407
XXXX
HMC407MS8GE
RoHS-compliant Low Stress Injection Molded Plastic
100% matte Sn
MSL1
[2]
H407
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
HMC407MS8G
/
407MS8GE
GaAs InGaP HBT MMIC
POWER AMPLIFIER, 5.0 - 7.0 GHz
v03.1006
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 407NA024NF1003 | 功能描述:環(huán)形MIL規(guī)格后蓋 RoHS:否 制造商:Amphenol PCD MIL 類型:MIL-DTL-38999 III, IV 系列:AS85049 產(chǎn)品類型:Environmental EMI/RFI Backshells 外殼類型:Straight 外殼大小:18 外殼材質(zhì):Aluminum Alloy |
| 407NS023NF1203 | 功能描述:環(huán)形MIL規(guī)格后蓋 RoHS:否 制造商:Amphenol PCD MIL 類型:MIL-DTL-38999 III, IV 系列:AS85049 產(chǎn)品類型:Environmental EMI/RFI Backshells 外殼類型:Straight 外殼大小:18 外殼材質(zhì):Aluminum Alloy |
| 407NS023NF2203 | 功能描述:環(huán)形MIL規(guī)格后蓋 RoHS:否 制造商:Amphenol PCD MIL 類型:MIL-DTL-38999 III, IV 系列:AS85049 產(chǎn)品類型:Environmental EMI/RFI Backshells 外殼類型:Straight 外殼大小:18 外殼材質(zhì):Aluminum Alloy |
| 407NS024NF1303 | 功能描述:環(huán)形MIL規(guī)格后蓋 RoHS:否 制造商:Amphenol PCD MIL 類型:MIL-DTL-38999 III, IV 系列:AS85049 產(chǎn)品類型:Environmental EMI/RFI Backshells 外殼類型:Straight 外殼大小:18 外殼材質(zhì):Aluminum Alloy |
| 407NS024NF1403 | 功能描述:環(huán)形MIL規(guī)格后蓋 RoHS:否 制造商:Amphenol PCD MIL 類型:MIL-DTL-38999 III, IV 系列:AS85049 產(chǎn)品類型:Environmental EMI/RFI Backshells 外殼類型:Straight 外殼大小:18 外殼材質(zhì):Aluminum Alloy |
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